MAX14979EETX+GH7【PDF 3/10 页】IC SWITCH LVDS HIGH BW 36TQFN

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MAX14979E

High-Bandwidth, ±15kV ESD Protection

LVDS Switch

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

(Voltages referenced to GND.)

V+.........................................................................-0.3V to +4.0V

All Other Pins...............................................-0.3V to (V+ + 0.3V)

Continuous Current (COM_ _ to NC_ _/NO_ _) ............ Q120mA

Continuous Current (AUX0_ to AUX1_/AUX2_)............... Q40mA

Peak Current (COM_ _ to NC_ _/NO_ _)

(pulsed at 1ms, 10% duty cycle)............................... Q240mA

Current into Any Other Pin .............................................. Q20mA

Continuous Power Dissipation (TA = +70NC)

36-Pin TQFN (derate 35.7mW/NC above +70NC) .......2.85mW

Operating Temperature Range ........................ -40NC to +85NC

Junction Temperature .................................................. +150NC

Storage Temperature Range ......................... -65NC to +150NC

Lead Temperature (soldering 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ELECTRICAL CHARACTERISTICS

(V+ = +3.0V to +3.6V, TA = TJ = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.3V, TA = +25NC.) (Note 2)

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

TQFN

Junction-to-Ambient Thermal Resistance (BJA) ............8NC/W

Junction-to-Case Thermal Resistance (BJC) .................1NC/W

PACKAGE THERMAL CHARACTERISTICS (Note 1)

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

POWER SUPPLIES

Operating Power-Supply Range

V+

+3.0

+3.6

ANALOG SWITCH

On-Resistance

RON

V+ = 3V, ICOM_ _ = -40mA,

VCOM_ _ = 0V, 1.5V, 3V

TA = +25NC

5.5

TMIN to TMAX

6.5

On-Resistance AUX Switches

RONAUX

V+ = 3V, IAUX0_ = -40mA, VAUX0_ = 0V,

1.5V, 3V

On-Resistance Match

Between Channels

RON

V+ = 3V, ICOM_ _ = -40mA,

VCOM_ _ = 0V, 3V (Note 3)

TA = +25NC

0.5

1.5

TMIN to TMAX

On-Resistance Flatness

RFLAT(ON)

V+ = 3V, ICOM_ _ = -40mA,

VCOM_ _ = 0V, 1.5V

0.01

Off-Leakage Current

ILCOM_

_(OFF)

V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V;

VNC_ _ or VNO_ _ = 3.3V, 0.3V

-1

On-Leakage Current

ILCOM_

_(ON)

V+ = 3.6V, VCOM_ _ = 0.3V, 3.3V; VNC_ _

or VNO_ _ = 3.3V, 0.3V or unconnected

-1

SWITCH AC PERFORMANCE

Insertion Loss

ILOS

RS = RL = 50I, unbalanced, f = 1MHz,

(Note 3)

0.6

Return Loss

RLOS

f = 100MHz

-23

Crosstalk

VCT1

Any switch to any switch;

RS = RL = 50I,

unbalanced, Figure 1

f = 25MHz

-50

VCT2

f = 125MHz

-26

SWITCH AC CHARACTERISTICS

-3dB Bandwidth

RS = RL = 50I, unbalanced

650

MHz

Off-Capacitance

COFF

f = 1MHz, COM_ _

3.5

On-Capacitance

CON

f = 1MHz, COM_ _

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